| Color | Black C + Silver |
| Dimensions (WxDxH) | 310 mm x 200 mm x 62 mm |
| System Fan | Fanless |
| Chassis Construction | Extruded aluminum alloys |
| CPU | Intel® Core™ i5-2xxE (above 2.5 GHz) Intel® Core™ i3-2xxE (above 2.2 GHz) Intel® Celeron® B8xx (above 1.6 GHz) |
| Chipset | Intel® QM67 |
| System Memory | On-board DDR3 2 GB memory 1 x 204-pin DDR3 SO-DIMM (system max: 10 GB) |
| Hard Drive | 2 x 2.5'' SATA 3Gb/s HDD/SSD bay |
| mSATA | 1 x mSATA (SATA 3Gb/s signal) |
| USB 3.0 | 2 |
| USB 2.0 | 4 |
| Ethernet | 2 x Combo (SFP Fiber/RJ-45) 1 x PCIe GbE by Intel® 82579 1 x PCIe GbE by Intel® 82583V |
| RS-232 | 4 x DB-9, 2 x RJ-45 with isolation |
| RS-422/485 | 2 x RJ-45 with isolation |
| Digital I/O | 8-bit digital I/O, 4-bit input/4-bit output |
| CAN-bus | 1 x Phoenix terminal block |
| Display | 1 x VGA, 1 x HDMI |
| Resolution | VGA: Up to 2048 x 1536@75Hz HDMI: Up to 1920 x 1200@60Hz |
| Audio | 1 x Line-out, 1 x Mic-in |
| Other | Optional 4-channel audio/video input PCIe Mini Card |
| Wireless | 1 x 802.11a/b/g/n 3T3R (Optional w/ EMB-WIFI-KIT03-R10) |
| PCIe Mini | 3 x Full Size (One Colay mSATA) |
| Power Input | Terminal Block: 9 V~36 V DC DC Jack: 10.5 V~36 V DC |
| Power Consumption | 19 V@3.3 A (Intel® Core™ i5-2540M with 4 GB DDR3 Memory) |
| Mounting | Wall mount |
| Operating Temperature | -20°C ~70°C with air flow (SSD), 5% ~ 95%, non-condensing |
| Operating Shock | Half-sine wave shock 5G, 11ms, 3 shocks per axis |
| Operation Vibration | MIL-STD-810F 514.5C-2 (with SSD) |
| Weight (Net / Gross) | 3.8 kg/6.5 kg |
| Safety / EMC | CE/FCC |
| Supported OS | Microsoft® Windows® Embedded Standard 7 E, Microsoft® Windows® XP Embedded |
| TANK-700-QM67-i5/2G-R22 | Fanless embedded system, Core i5 Dual Core 2xxE CPU (Above 2.5GHz), TDFanless embedded system, Core™ i5 Dual Core 2xxE CPU (Above 2.5 GHz), TDP 35W, 2GB DDR3 on-board memory, VGA/HDMI, USB 3.0, SATA 3.0, SFP Fiber, Isolated CAN, Audio, 9 V-36 V DC input, -20~70°C, R22 |
| TANK-700-QM67-i3/2G-R22 | Fanless embedded system, Core™ i3 Dual Core 2xxE CPU (Above 2.2 GHz), TDP 35W, 2GB DDR3 on-board memory, VGA/HDMI, USB 3.0, SATA 3.0, SFP Fiber, Isolated CAN, Audio, 9 V-36 V DC input, -20~70°C, R22 |
| TANK-700-QM67-C/2G-R22 | Fanless embedded system, Celeron® Dual Core B8xx CPU (Above 1.6 GHz), TDP 35W, 2GB DDR3 on-board memory, VGA/HDMI, USB 3.0, SATA 3.0, SFP Fiber, Isolated CAN, Audio, 9 V-36 V DC input, -20~70°C, R22 |
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