Fanless embedded system with WAFER-BTi, Intel® Celeron® J1900 2.42 GHz processor, four serial ports, pre-installed 2GB DDR3L SO-DIMM
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  • High Definition AMD® R-series APU
  • Four independent HDMI display video outputs
  • Fanless design supporting 0ºC ~ 50ºC operating temperature
  • SIM card support 3G/LTE wireless connection
  • Support IPMI 2.0 via iRIS-2400 module
Model Name IDS-200-A70M
Color Black
Dimensions (WxDxH) 251 mm x 173.35 mm x 57 mm
System Fan Fanless
Chassis Construction Extruded aluminum alloy heavy duty steel sheet
CPU AMD® R-series dual-core R-260H 2.1GHz, TDP 17W
Chipset AMD® A70M
System Memory 2 x 204-pin DDR3 SO-DIMM (system max: 16GB)
Hard Drive 1 x 2.5'' SATA 6Gb/s HDD/SSD drive bay
mSATA 1 x PCIe Mini slot
USB 3.0 2
USB 2.0 2
Ethernet LAN1: Intel® I210 PCIe GbE controller with IPMI 2.0 support 
LAN2: Intel® I211 PCIe GbE controller
RS-232 1 x RJ-45
Display 4 x HDMI
Resolution 1920 x 1080 @ 60Hz
Audio 1 x Line out, 1 x S/PDIF
Other 1 x SIM standard card slot
Wireless 802.1b/g/n 2T2R (optional)
PCIe Mini 1 x Full size (supports mSATA), 1 x Half size
Power Input 10V~30V DC
Power Consumption 19V@1.78A (AMD® R-260H with 4GB memory)
Mounting Wall mount, VESA mount 75
Operating Temperature 0°C ~ 50°C with air flow, 10% ~ 90%, non-condensing
Operating Shock Half-sine wave shock 5G, 11ms, 3 shocks per axis
Operation Vibration MIL-STD-810F 514.5C-2 (with SSD)
Weight (Net / Gross) 5.24kg/6.5kg
Safety / EMC CE/FCC
Supported OS Microsoft® Windows 8, Microsoft® WES7E
 

EOL NOTICE ISSUED FOR IDS-200W-A70Mi/4G-R10 ONLY, SEE NOTE FOR DETAILS

IDS-200-A70Mi/4G-R10 Fanless embedded system, AMD® APU dual-core R260H 2.1 GHz, TDP 17W, 4GB DDR3 SO-DIMM (2 x 2GB) pre-installed, 4 x HDMI, iRIS-2400 optional, 10V~30V DC input, R10, RoHS
IDS-200W-A70Mi/4G-R10 Fanless embedded system, AMD® APU dual-core R260H 2.1 GHz, TDP 17W, 4GB DDR3 SO-DIMM (2 x 2GB) pre-installed, 4 x HDMI, 2T2R 802.11b/g/n wireless, iRIS-2400 optional, 10V~30V DC input, R10, RoHS

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